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. Author manuscript; available in PMC: 2016 Mar 2.
Published in final edited form as: Chem Soc Rev. 2011 Mar 25;40(7):3677–3702. doi: 10.1039/c0cs00138d

Table 2.

Nanochannels/nanoslits fabricated in various polymeric materials along with the characteristic geometry of the structures and their reported application

Material Dimension (nm, width × depth) Fabrication method Application Reference
PDMS 690 × 80 Crack-induced tunable λDNA stretching Huh et al. (2007)165
PDMS 7 × 103 nm2 (area) Tunnel cracking Nanoparticle trapping Mills et al. (2010)166
PDMS 1470 × 275 Wrinkle induced by oxygen plasma Protein preconcentration Seok et al. (2008)257
PDMS 100, 500 (depth) Deformation of thin PDMS DNA stretching Park et al. (2009)171
PDMS 200 × 60 Collapse of micron-scale PDMS microchannels. Glass/PDMS bonding substrate DNA elongation and surface enhanced Raman detection of nucleic acids Park et al. (2009)172
PDMS 400 × 20 Nanochannels cracked from PS petri-dish induced by ethanol Ion selective enrichment Xu et al. (2010)37
PMMA 200 × 2000 Proton beam writing, thermal fusion bonding NA Shao et al. (2006)188
SU-8, SiO2 layer 250 × 250 EBL and NIL, thermal fusion bonding DNA stretching Thamdrup et al. (2008)159
PMMA, COC, PC 3000/7000 × 100 Nanomolding replication, NIL, oxygen plasma treatment with thermal fusion bonding λDNA transport dynamics and DNA mobilities Chantiwas et al. (2010)59
PMMA 300 × 500, 300 × 140 and 75 × 120 Imprinting nanostructure from Si etched into PMMA thin film DNA stretching Guo (2004)134
PMMA 10 000 × 80 Si molding with thermal fusion bonding NA Abgrall et al. (2007)191
PC 100-900 wide, 200 nm wire Hot embossing of silica nanowire molding with PC substrate, PDMS for cover plate bonded material NA Zhang et al. (2008)194
PMMA 185 × 85 Replication of polymer stamp and polymer nanofluidic channels by NIL using polymer stamp NA Wu et al. (2010)196
PI (Polyimide) 2000-30 000 wide, 100 and 500 nm deep Spin coat PI onto Si wafer and deposition of Al as sacrificial layer; etch Al, deposit another layer of PI and remove patterned Al EOF measurements Eijkel et al. (2004)203