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. 2016 Mar 18;6:23457. doi: 10.1038/srep23457

Figure 3. Process flow for fabrication of SiC UV photodetector.

Figure 3

Cross-section of SiC photodetector with “ultra-thin” Schottky contact. The SiC thickness is around 2 μm and the buffer layer thickness is around 5 nm (not to scale).