Figure 8. C-SAM images showing the delamination at interface between silicone and molding part of degraded BLUE LED.

The red area show where the cracks/delamination occur when the samples are exposed to high temperature exposures. The left side image shows the fresh LED’s C-SAM image and right side image is the degraded LED’s C-SAM image (sample 3 in Table 3). The die attach area can be identified easily by a square exactly at the center of the LED package.