Table 5. Comparison of mechanical strain and von misses stress at the LED chip- encapsulant interface and encapsulant- molding part interface for LEDs under On and Off conditions.

	LED chip – Encapsulant interface		Encapsulant – Molding part interface
	LED On state	LED Off state	LED On state	LED Off state
Maximum Mechanical strain	0.0287	0.27E − 5	0.009	0.27E − 5
Maximum Von- Misses stress (Pascals)	0.15E + 9	4.1E + 4	6.7E + 4	4.1E + 4