Real-time conversion of C=C double bond of control and experimental adhesive formulations with different PI, (A) two-component PI (CQ/EDMAB), (B) three-component PI (CQ/EDMAB/OPPIH), and conversion of C=C or methoxysilyl moiety (-SiOCH3) at higher MPS concentration (C) MPS 50 wt% (E3-2PI and E3-3PI), (D) MPS 100 wt% (MPS-2PI and MPS-3PI), and (E) DC and vs. MPS content. The adhesives were light-cured for 40 s at 25 °C using a commercial visible light lamp (Spectrum® 800, Dentsply, Milford, DE. Intensity is 550 mW/cm2).