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. 2016 May 16;6:26032. doi: 10.1038/srep26032

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Burst pressures for PDMS/glass chips after leakages by successively flowing the dye inside channels (a) and after successive processes of (i) detachment of PDMS substrate and glass coverslip and (ii) bonding (b). Inset: PDMS/glass microdevice with leaked channel after exposure to an excessive flow rate. Lines in top of columns are the error bars (confidence intervals). The first pressure in 0 is relative to the native SWB device.