Table 1. Comparative study.

Bonding	Applicability	Cost	Time	Functionalization†	Filling£	ULSIǂ	Storing†	ReuseΩ	Adhesion (MPa)Σ	References
Surface oxidation	Limited€	High	Short	No	No	Yes	No	No	0.40–0.51	16,17,50
Adhesive	Moderate	Low	Moderate	Moderate	Yes	Moderate	Yes	No	0.20–0.51	18, 19, 20, 21, 22, 23, 24,31
Functionalization	Wide	High	Long	No	No	No	Yes	No	0.18–1.03	25, 26, 27, 28, 29, 30,34, 35, 36
SWB	Wide	Low	Short	Yes	No	Yes	Yes	Yes	0.63–0.98	This paper

Comparison of some parameters related to methods for bonding PDMS to PDMS itself, glass, and non-silicon compounds.

^€Limited to silicon-based compounds.

^†Before bonding.

^£Alteration in dimensions of microchannel.

^ǂViability for ULSI processes.

^ΩRegeneration after successive leakages and reversible property.

^ΣBurst pressure.