Fig. 2.

Experimental and computational studies of the physics of buckling in an ultralow modulus silicone for strain isolation of assembled chips and interconnects. (A) Optical images of uniaxial stretching of a module that includes a 2 × 2 array of 2J solar cells. (Scale bars, 5 mm.) Three-dimensional FEA results of (B) the interconnect network and (C) top surface (to the left), the bottom surface (to the right) of the system, and the interface of top and bottom core/shell (middle). Optical images and 3D-FEA results of a corresponding 4 × 4 system laminated on the forearm in a (D) bent and (E) twisted configuration. Electrical performance of systems under biaxial stretching from 0 to 30% for the case of an (F) 2 × 2 array of 2J solar cells (current–voltage curves under AM 1.5 illumination) and a (G) 2 × 2 array of chip-scale batteries (charge–discharge curves).