Skip to main content
. 2016 Jun 15;6:27933. doi: 10.1038/srep27933

Figure 2. Thermal properties of base resin.

Figure 2

(a) Glass transition temperature (Tg) dependence on the ratio of ESBO: BFDGE found in the base resins (i.e., unfilled). The data point outlined in the box shows the base resin ratio (25:75 wt% ESBO: BFDGE) selected for formulation of CNF-filled inks. N = 5 per formulation. Error bars indicate standard deviation of the measurements. (b) Resultant storage modulus of the cured base resins from DMTA. Increasing amount of BFDGE in the ESBO: BFDGE ratio while decreasing ESBO resulted in an increase in the modulus.