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. 2016 Jun 16;6:27975. doi: 10.1038/srep27975

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(a) Amperometric current response of the working electrodes as a function of the electroplating pulse current intensity. (b) STEM image of bare DLE graphene flakes on top of the grid with a higher magnification inset before electroplating with CuNCs. (c–h) FESEM Images of the DLEG-CuNCs electrodes at different electroplating pulse current during the electroplating process suggesting the formation of the finest CuNCs with great uniformity and population density at 200 μA and less CuNCs population density for all the other applied current.