Figure 2. Multi-particle manipulation demonstrations.

(a) Particle sorting. Six 600 μm solder balls are assigned to two groups, three particles each. The device separates the particles into the assigned groups. (b) Particle pattern transformation. A diamond pattern of four objects—a SMT resistor, a mustard seed, a chia seed and a candy ball—is transformed into a square pattern. (c) Droplet merging. Two 8 μl water droplets on carriers are brought together and merged into a single droplet. Scale bars, 1 cm.