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. Author manuscript; available in PMC: 2016 Sep 22.
Published in final edited form as: IEEE Trans Compon Packaging Manuf Technol. 2015 May 7;5(9):1201–1218. doi: 10.1109/TCPMT.2015.2417801

Fig. 23.

Fig. 23

(a) Schematic illustration of the prestrain strategy for fabricating serpentine interconnects with enhanced levels of stretchability. (b) SEM image of the serpentine structures before releasing the prestrain of the substrate. (c) SEM image of the serpentine interconnect after releasing the prestrain of the substrate. (d) Illustration of the geometric parameters for a serpentine interconnect, with top and cross-sectional views. (Reprinted with permission from [41].)