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. Author manuscript; available in PMC: 2016 Sep 22.
Published in final edited form as: IEEE Trans Compon Packaging Manuf Technol. 2015 May 7;5(9):1201–1218. doi: 10.1109/TCPMT.2015.2417801

Fig. 7.

Fig. 7

Predicted stretchability and compressibility versus the prestrain for the island–interconnect mesh design (island: 20 × 20 μm2 and 50-nm thick, and interconnect: 20 × 4 μm2 and 50-nm thick) when the failure strains of interconnect and island are 1%. (Reprinted with permission from [28].)