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. 2016 Oct 10;10(5):054114. doi: 10.1063/1.4964717

TABLE I.

PDMS etch rate and selectivity as a function of RF power and RF bias power in the ICP system.

Sample RF power (W) RF bias power (W) PDMS etch rate (μm/h) Selectivity (PDMS/PR etch rate)
1 100 200
2 300 200 39.6 1.4
3 400 200 42.6 1.3
4 500 200 58.6 1.5
5 700 200 69.0 1.5
6 500 50 30.7 1.4
7 500 100 45.0 1.5
8 500 200 58.6 1.5
9 500 350 72.8 1.6