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. 2009 Nov 20;10(5):053001. doi: 10.1088/1468-6996/10/5/053001

Figure 20.

Figure 20

Methods of controlling current distribution across punch/die/compact assembly: (a) currents are forced to flow across powders, (b) two electrically insulating discs—interposed between the punches and sample inhibit current flow across the powder and (c) uniform current and temperature distributions across the punch/die/compact assembly are promoted by preventing overheating at the punch/spacer interface (adapted from [116, 117, 119], respectively).