Figure 5.

(a) Plots of tan δ vs temperature and storage modulus vs temperature for analogous materials made from either the (a) thiol–ene or CuAAC reactions and (b) the generalized polymeric structure. The thiol–ene resin composed 4 mol % DMPA and the CuAAC resin composed 2 mol % CuCl2[PMDETA] and 4 mol % DMPA, and both were cured with 10 mW/cm2 UV light. Representative curves are presented as the third cycle in the DMA.