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. 2016 Nov 4;16(11):1608. doi: 10.3390/s16111608

Figure 9.

Figure 9

(a) Schematic diagram of the packaged multi-sensor MEMS chip for simultaneous measurement of pressure, temperature and flow rate; (b) multi-sensor MEMS chip packaged in a micro-channel for flow rate characterization. After packaging of the chip, the space left around the chip was filled with a polymer adhesive to ensure smooth flow over the chip.