Table 1.

Summary of the key multi-sensor MEMS chips reported in the literature since 1987.

S No	Year	Ref.	No of Sensors	Parameters Sensed													Substrate		CMOS Process
				Flow Rate/Mass Flow	Wall Shear Stress	Pressure	Temperature	Gas	Density	Light Intensity	Electric Conductivity	Flow Direction	Humidity	Air Speed	Magnetic Field	Acceleration	Silicon	SOI	Yes	No
1	1987	[9]	3	√		√	√										√			√
2	1992	[15]	5			√	√	√				√		√			√		√
3	1996	[10]	3		√	√	√											√		√
4	2000	[2]	4	√	√	√	√										√			√
5	2001	[18]	4				√	√									√		√
6	2002	[3]	4				√	√									√		√
7	2004	[4]	3	√			√		√								√			√
8	2005	[11]	4			√	√			√	√						√			√
9	2005	[5]	3		√	√	√										√			√
10	2005	[17]	3			√	√						√				√ 1			√ 2
11	2007	[16]	4			√	√						√			√		√		√ 2
12	2009	[6]	3	√			√					√					√			√
13	2011	[8]	2	√		√											√		√
14	2013	[7]	8			√	√			√		√	√	√	√	√		√		√

¹ Sensor chips have been fabricated using silicon wafers bonded with glass wafers; ² non-CMOS Silicon/SOI sensor chips have been packaged with independent Bi-CMOS interface circuitry chips.