Fig. 10.

a Dry etching profile of 25 μm via. b Sealing bumps fabricate before TSV filling. c Void-free filled TSVs by X-ray inspection. d The black dots are Cu TSVs; the white area is the SiO2 region; the gray-colored area is the metal lines. e TSV cross section with Cu bumps on both sides. f Final structures of Cu bumps with TSVs [20]