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. 2017 Jan 19;12:56. doi: 10.1186/s11671-017-1831-4

Fig. 14.

Fig. 14

Mechanism causing the Cu seed layer missing due to sponge-like defects and deep scallops. a After Si etch. b After Cu seed layer deposition. c Microscopic image of the Cu seed layer deposited at 60 μm × 250 μm TSV [45]