Skip to main content
. 2017 Jan 19;12:56. doi: 10.1186/s11671-017-1831-4

Fig. 3.

Fig. 3

Cross-sectional SEM micrograph images of 2 × 30 μm TSV after alkaline Cu seed deposition prior to ECD fill. a Overview, b top, c middle, and d bottom of the TSV. An excellent conformality, in the range of 80%, is obtained for the alkaline Cu seed in the TSV region of 4-μm pitch [13]