Figure 2.

Scheme illustrating three template deposition methods used which differ for the way used to contact the PC membrane (8) to the flat disk Cu electrode (7). From left to right: (a) adhesion by the pressure furnished by the melamine foam (5); (b) adhesion by using a Nafion interlayer (9) as polyelectrolytic glue; (c) as (b), but using a PC membrane pre-sputtered with the gold interlayer (10). Other components: (1) Cu counter electrode; (2) Pt counter electrode; (3) working electrode; (4) Ag/AgCl KCl sat reference electrode; (6) 0.4 M CuSO₄, 0.01 M H₂SO₄ solution (reprinted with permission from [29]).