Fig. 2. 3D-printed four-lens systems on the chip.

(A) CMOS image sensor with compound lenses directly printed onto the chip. The change in color on the sensor surface results from scratching off functional layers, such as the lenslet array and the color filters. (B) Detail of one lens group with four different FOVs for foveated imaging forming one camera. The combined footprint is less than 300 μm × 300 μm.