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. 2017 Mar 21;7:44901. doi: 10.1038/srep44901

Figure 3. Results of finite element analysis for the proof-of-concept microdevice.

Figure 3

(a,b) out-of-plane displacement for the bottom and top surfaces, respectively, unit on the scale is nanometers. (c) temperature distribution of the microdevice, unit on the scale is Kelvins.