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. 2017 Apr 18;12:279. doi: 10.1186/s11671-017-2049-1

Table 1.

Deposition conditions of the AlN films by PEALD

Precursor 1 TMA (99.999%)
Precursor 2 Ar/N2/H2 (99.999%)
Carrier gas Ar (99.999%)
Gas line temperature 60 °C
Flow rate of carrier gas (UHP Ar) 5 sccm
Flow rate of N precursor 5 sccm
RF power 60 W
RF plasma frequency 13.56 MHz