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. Author manuscript; available in PMC: 2017 Apr 24.
Published in final edited form as: Nano Lett. 2016 Mar 23;16(4):2198–2204. doi: 10.1021/acs.nanolett.5b04364

Figure 1.

Figure 1

IMP fabrication process. A. Bonded plates assembly, PDMS thickness is controlled by changing the relative thickness of Si wafer and the shims in four corners, PDMS sheet thickness is ~150 μm; B. Thermoplastic plate is first O2 plasma treated for 1 min and then treated with 1.5% of APTES solution for 20 min, patterned PDMS substrate is O2 plasma treated for 1 min, a silane coupling reaction followed by amine–epoxy bond formation at the interfaces of treated thermoplastic and PDMS at room temperature; C. Integrated mechanobiology platform, in a 96 well plate configuration. The bottom surface of the plate is composed of PDMS nanotopographies.