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. Author manuscript; available in PMC: 2017 Jun 1.
Published in final edited form as: IEEE J Solid-State Circuits. 2017 Apr 27;52(6):1576–1590. doi: 10.1109/JSSC.2017.2686580

Table II.

Comparison to the state-of-the-art MEA systems


Reference [19] [6] [21] [22] This work
Type In-pixel Amp In-pixel Amp In-pixel Amp Switch Matrix Switch Matrix
Technology 0.5 μm 0.13 μm 0.18 μm 0.35 μm 0.18 μm
Active Area 2.28×1.14 mm2 9 pixel groups of 0.128 mm2 1×1 mm2/2x2 mm2 3.85×2.10 mm2 4.48×2.43 mm2
No. Transducers 32768 144 4225 / 1024 26400 59760
No. Different Measurement Modes 1 4 1 1 5
Pixel Pitch 8.775 μm 89.4 / 357.8 μmd 16 / 32 μm 17.5 μm 13.5 μm
Transducers/mm2 12987 125 / 7.8 977, 3906 3265 5487
No. Voltage Readout Channels 32768 144 4225 1024 2048 AP + 32 LFP
A/D Conversion 128 pipeline Off chip Off chip 1024 single-slope 32 + 4 SAR
ADC Resolution 9 bit - - 10 bit 10 bit
Sampling Rate 2.4 kS/sa - 77 (25) kS/sa 20 kS/s 20 kS/s
Input-referred Noise - 12.7 μVrmse 44 μVrmsb 2.4 μVrmsb,c 2.4 μVrmsb,c
Total Power 4 W - - 75 mW 86 mW
Die Size 9.5×9.5 mm2 2.2×2 mm2 - 10.1×7.6 mm2 12×8.9 mm2

a

When reading out all channels.

b

Noise integration over 300Hz-10kHz.

c

Including ADC.

d

Equivalent square-shaped pixel dimension, for the same spatial density.

e

Noise integration over 0.5Hz-10kHz.