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. 2015 Nov 23;8(11):7926–7937. doi: 10.3390/ma8115432

Table 2.

The steps of the applied grinding and polishing process.

Abrasive Time (min) Load (N) Revolution (min−1) Direction
P 320 SiC 1 22 220 counter
P 600 SiC 1 22 220 counter
P 1200 SiC 1 22 220 counter
P 2400 SiC 1 22 220 counter
6 μm diamond 15 27 150 counter
3 μm diamond 6 27 150 counter
0.05 μm SiO 3 27 125 comply