Table 3.

Commercial bonding systems used in the study.

Name	Manufacturer	Number of Components	Type	Resin/Monomer	pH	Mode of Etching
						Total-Etching	Self-Etching	Selective Enamel Etching
Prime&Bond One Etch&Rinse	Dentsply, UK	1	2-step	TCB resin, phosphoric acid modified acrylate resin (PENTA), UDMA, TEGDMA, HEMA	2.5 *	+
Te-Econom Bond	Ivoclar Vivadent, Germany	1	2-step	HEMA, di- and mono-methacrylates	2.6 *	+
ExciTE® F	Ivoclar Vivadent, Germany	1	2-step	Bis-GMA, HEMA, phosphoric acid acrylate, dimethacrylates	2.5 *	+
OptiBond™ Solo Plus	Kerr/USA	1	2-step	Bis-GMA, GPDM, HEMA	2.2 *	+
G-ænial® Bond	GC, Japan	1	1-step	4-MET, phosphoric acid ester monomer	1.5 [92]		+
G-Bond®	GC, Japan	1	1-step	UDMA	2.0 [93]		+
Clearfil S3 Bond Plus	Kuraray America, USA	1	1-step	MDP, Bis-GMA, HEMA	2.3 *		+
Panavia F 2.0 ED Primer II	Kuraray America, USA	2 (A + B)	2-step	2-Hydroxyethyl methacrylate, 10-methacryloyloxydecyl dihydrogen phosphate N-Methacryloyl-5-aminosalicylic acid	2.4 [94]		+
Prime&Bond® One Select	Dentsply, UK	1	1- or 2-step	bifunctional acrylate, acidic acrylate, phosphoric acid ester	1.6 *	+	+	+
Futurabond M+	VOCO, Germany	1	1- or 2-step	Bis-GMA, HEMA	2.0 [95]	+	+	+

* Information obtained from the manufacturer (safety data sheet).