Figure 15.

(A) Schematic diagram of the additive 3D manufacturing process. The 3D fabrication process with embedded and electrically conductive structures (a). 3D microelectronics components, including parallel-plate capacitors, solenoid-type inductors, and meandering-shape resistors (b). A 3D LC tank, which is formed by combining a solenoid-type inductor and a parallel-plate capacitor (c). A wireless passive sensor demonstration of a “smart cap,” containing the 3D-printed LC-resonant circuit (d); (B) An optical image of fabricated microelectronics components; (C) The proposed “smart cap” for rapid detection of liquid food quality featuring wireless readout. Reproduced from [50], with permission from Macmillan Publishers Limited, part of Springer Nature © 2017.