Figure 18.

(A) Schematic representation of a sensing phenomenon of the proposed humidity Sensor; (B) The inkjet-printed sensor’s electrodes with sliver ink. Reproduced from [57], with permission from © 2016 Elsevier Ltd; (C) Optical picture of the inkjet-printed capacitors and resistor on paper. Reproduced from [58], with permission from © 2011 IEEE; (D) Overhead view of the continuous sensor (black) on a carbon substrate (a), and thermal image produced by EIT formed upon cooling the center of the continuous sensor from 68.5 °C (red) to 7 °C (blue) using a Peltier element. Reproduced from [59], with permission from © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim; (E) Photograph of an IC 7400N prepared for DLW (a), Scanning electron micrograph (SEM) of temperature probes on the chip surface (b), SEM showing a close-up of temperature probes colored in green (c), scheme of the three probe positions on the chip on which measurements have been performed (d), the temperature measured at the three probe positions and DC of the applied voltage (e). Reproduced from [60], with permission from © 2015 AIP Publishing LLC.