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. Author manuscript; available in PMC: 2018 May 1.
Published in final edited form as: Carbon N Y. 2017 Jan 11;115:441–448. doi: 10.1016/j.carbon.2017.01.023

Figure 10.

Figure 10

TOF-SIMS measurements of Cu-Ni samples (a) as-deposited Cu-Ni film of copper thickness of 500 nm. (b)-(h) as-grown samples with Cu-Ni alloy of copper thicknesses of 100 nm, 150 nm, 200 nm, 250 nm, 500 nm, 750 nm, and 1000 nm respectively each with 50 nm Ni, representing Cu-, Ni-, and C- counts with respect to sputtering depth. Abundant Cu- concentration remains the same with changing Cu thicknesses but Ni- concentration decreases as Cu thickness increases.