Table 2.
Material | Element | Concentration (Mass %) | Total (Mass %) |
---|---|---|---|
Organic Epoxy Resin | C | 18.10 | 31.8 |
H | 1.80 | ||
N | 0.32 | ||
O (Org) | 6.03 | ||
Br | 5.07 | ||
Sb | 0.45 | ||
Inorganic Glass Fiber | SiO2 | 24.70 | 37.6 |
Al2O3 | 9.35 | ||
CaO | 3.36 | ||
MgO | 0.081 | ||
BaO | 0.0022 | ||
NaO | 0.09 | ||
SrO | 0.035 | ||
Metal Circuit Solder | Cu | 14.60 | 30.1 |
Sn | 5.62 | ||
Pb | 2.96 | ||
Lead Frame | Fe | 4.79 | |
Ni | 1.65 | ||
Cr | 0.356 | ||
Mo | 0.016 | ||
Contacts | Ag | 0.045 | |
Au | 0.0205 | ||
Pd | 0.022 |