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A new packaging method for bonding the PDMS-based microfluidic chip and FET devices. (a) The FET covered by PDMS was placed on the surface of a PMMA plate. (b) PCB was carved for mounting the FET. (c) The tape was pasted on top of the PCB and the cavity of the PCB was filled with PDMS. (d) The PMMA with FET was aligned in the cavity of PCB. (e) The whole chip was baked for 1 h.
