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. 2017 Jun 25;17(7):1495. doi: 10.3390/s17071495

Figure 4.

Figure 4

DMF device assembly: (a) Additional instrumentation for the DMF chip control; (b) Chip cross section, evidencing all the constituting layers; (c,d) Photographs of the actual DMF chip, showing the most relevant chip regions. Adapted from original in reference [24].