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. 2017 Aug 29;7:9732. doi: 10.1038/s41598-017-10495-8

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© The Author(s) 2017

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Characterization of the TiO_x NT arrays used in the multisensor chip: (a) SEM image taken of the chip surface covered with NT array; (b) HAADF-STEM image, the inset shows a surface rendering of the 3D STEM tomographic reconstruction viewed along the NT length; (c,d) SAED patterns of as-grown NTs and NTs annealed at 400 °C, respectively; (e,f) the XPS peaks related to Ti 2p (e) and O 1s (f) for the as-grown NTs, red lines show the envelope curves of all fitted peaks to compare with the experimental data (open circles).