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. 2017 Sep 8;7:11020. doi: 10.1038/s41598-017-11383-x

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© The Author(s) 2017

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Fabrication process of gold thin film perforated with large-area nano-hole array. (1) Wafer cleaning by BOE for 1 min, deionized water 5 min, and nitrogen drying. (2) Sputtering gold of 100 nm. (3) Gold lift off by NOA61 and transferred on glass slide, the residual NOA 61 and parietal gold film in holes of silicon template turns into gold cylindrical bumps on glass based gold thin film. (4) RIE etching with CHF₃ and O₂ to etch the residual NOA 61 in holes, and SF₆ to etch the gold cylindrical bumps.