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. 2017 Sep 8;7:11020. doi: 10.1038/s41598-017-11383-x

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© The Author(s) 2017

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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(a) SEM of gold thin film with a gold cylindrical bumps with an approximate height of 180 nm attached on each hole. (b) SEM of gold thin film with the cylindrical bumps is greatly cut down with an approximately height of 32 nm. The power of SF₆ RIE etching is 200 W and the pressure is 5 Pa. In order to take pictures of the gold cylindrical bumps, the gold film adhered to glass slide is 45.0° tilted with respect to the electron beam.