Figure 5.
Fabricated micro accelerometer. (a) Electrodes on the spring-mass structure; (b) Electrodes on the top die; (c) Packaged micro accelerometer in which the electrodes on the top die and spring-mass structure form the area-changed capacitive transducer; (d) SEM photograph of the electrodes; (e) Additional PSPI between the metal layer and silicon substrate, the wire climbs the edge of the PSPI for transferring the signal from the electrodes and pads on PSPI.