Table 2. Analysis of total IMC thickness with respect to different aging times, constant atmospheric condition and constant temperature for each solder joint.

Solder joint	Atmospheric condition	Annealing temperature (°C)	Aging time(hours)	Total thickness of IMCs (μm)(Cu6Sn5+ Cu3Sn)	Ref.
Sn3.5-Ag	Air	260	0.16	20.50	[100]
			0.50	29.30
			1.00	38.45
Sn0.7-Cu	Vacuum	240	24.0	3.77	[101]
			72.0	4.40
			120.0	4.85
Sn3.0-Ag0.5-Cu	Air	150	100.0	4.80	[102]
			200.0	5.50
			500.0	6.50