Table 1.
Mass density and atomic concentration of SiON:H films as a function of the N2O gas flow. The last column represents the thicknesses of fully oxidized SiO2:H after PCT of 30 h. The samples were deposited at 160 °C and 10 sccm for both SiH4 and NH3.
N2O sccm | Density g/cm3 | Si at% | O at% | N at% | H at% | Oxidation nm |
---|---|---|---|---|---|---|
0 | 2.25 | 27.9 | 0.0 | 45.2 | 26.8 | 5 |
2 | 2.22 | 27.0 | 9.8 | 37.3 | 25.9 | 7 |
4 | 2.18 | 29.1 | 16.5 | 32.2 | 22.2 | 8 |
6 | 2.17 | 28.7 | 20.5 | 28.8 | 22.0 | 10 |
8 | 2.15 | 29.7 | 26.9 | 24.5 | 18.9 | 18 |
10 | 2.13 | 29.1 | 32.3 | 20.8 | 17.9 | 30 |