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. 2017 Nov 8;7:15109. doi: 10.1038/s41598-017-15408-3

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© The Author(s) 2017

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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(a) Thermal conductivity and elastic modulus for control and composites. (b) Stress vs strain curve for control and composite films. (c) Temperature variation of top surfaces of the control and composite microfluidic chip, contact heated from below (100 °C) with varying concentration of micro-diamond with respect to time. (d) Thermogravimetric curve for control and composite microfluidic chips. (e) Derivative of thermogravimetric curve of control and composite microfluidic chips.