Figure 6.

Fabrication process of the 3-axis integrated tactile sensor: (a) Received CMOS substrate; (b) Thick SiO₂ film deposition; (c) Planarization and back grinding; (d) Pad opening; (e) Au electroplating; (f) Planarization of Au bumps and an Au sealing frame; (g) Formation of a ground (GND) electrode and rewiring; (h) Formation of 3-axis capacitor electrodes and rewiring; (i) Au-Au thermo-compression bonding; (j) Formation of a diaphragm; (k) Formation of bonding pads; (l) Surface mounting on a glass substrate with interconnections by an anisotropic conductive film (ACF).