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. 2017 Jun 13;125(6):066001. doi: 10.1289/EHP483

Figure 3.

Stacked bar graph plots assigned scores (y-axis) of economic feasibility, technical feasibility, environmental impacts, ecological hazards, human health impact and physical chemical hazard across solder alloys (x-axis).

Sample output from MAUT decision tool comparing alternatives to lead solder. SnPb is a solder alloy composed of 63% Sn/37% Pb; SAC (Water) is a solder alloy composed of 95.5% Sn/3.9% Ag/0.6% Cu; water quenching is used to cool and harden solder; SAC (air) is a solder alloy composed of 95.5% Sn/3.9% Ag/0.6% Cu; air is used to cool and harden solder; SnCu (water) is a solder alloy composed of 99.2% Sn/0.8% Cu; water quenching is used to cool and harden solder; SnCu (air) solder alloy composed of 99.2% Sn/0.8% Cu; air is used to cool and harden solder [Malloy et al. 2013 with permission from Wiley Online Library http://onlinelibrary.wiley.com/journal/10.1002/(ISSN)1551-3793/homepage/Permissions.html)]. Note: Ag, silver; Cu, copper; Pb, lead; Sn, tin.