Table 1. Etch Details in the Transfer Process.
| etched layer | gases | power (W) | set pressure (mTorr) | etch time (s) |
|---|---|---|---|---|
| PPA+PMMA | 1:4 O2/N2 | 10 | 15 | 4–6 |
| SiO2 | CHF3 | 100 | 15 | 12 |
| HM8006 | O2 | 20 | 15 | 75 |
| Si | 1:3.3 SF6/CHF3 | 200 | 15 | 16 |
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