Fig. 5.

Mechanical characterization of GSH-Au hydrogels, CYS-CdTe hydrogels and MPA-CdTe hydrogels. Oscillatory stress/strain (a), continuous step moduli/strain (b) and rheological dynamic oscillatory frequency sweep (c) of GSH-Au hydrogels (black line: Au, ~ 3 nm, red line: Au, ~ 8 nm). Oscillatory stress/strain (d), continuous step moduli/strain (e) and rheological dynamic oscillatory frequency sweep (f) of CYS-CdTe hydrogels (black line: ~ 3.2 nm, red line: ~ 3.7 nm; solid symbol: G′, empty symbol: G″). Oscillatory stress/strain (g), continuous step moduli/strain (h) and rheological dynamic oscillatory frequency sweep (i) of MPA-CdTe hydrogels (black line: ~ 2.7 nm, red line: ~ 3.1 nm; solid symbol: G′(ω), empty symbol: G″(ω))