Figure 4.
Optical micrographs show that the 16 shanks naturally bundle when the as-fabricated device is pulled out of the deionized water. Omnetics connectors were mounted on the arrays using a solder reflow process and medical grade epoxy. The figure shows (a) the as-fabricated a-SiC MEA after release from deionized water, (b) after an Omnetics connector is soldered onto the bond pads and (c) a packaged device for implantation or in vitro electrochemical characterization.