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. Author manuscript; available in PMC: 2019 Feb 1.
Published in final edited form as: J Neural Eng. 2018 Feb 1;15(1):016007. doi: 10.1088/1741-2552/aa8f8b

Figure 4.

Figure 4

Optical micrographs show that the 16 shanks naturally bundle when the as-fabricated device is pulled out of the deionized water. Omnetics connectors were mounted on the arrays using a solder reflow process and medical grade epoxy. The figure shows (a) the as-fabricated a-SiC MEA after release from deionized water, (b) after an Omnetics connector is soldered onto the bond pads and (c) a packaged device for implantation or in vitro electrochemical characterization.