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. 2018 Jan 9;9:91–101. doi: 10.3762/bjnano.9.11

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Copyright © 2018, Puydinger dos Santos et al.

This is an Open Access article under the terms of the Creative Commons Attribution License (https://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

The license is subject to the Beilstein Journal of Nanotechnology terms and conditions: (https://www.beilstein-journals.org/bjnano/terms)

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Electrical resistivities of Co–C, Cu–C and Au–C FEBID materials as a function of the annealing temperature, showing a monotonically decrease with temperature increase for all the deposits. Percolation of Co grains and release of oxygen are the main mechanisms for the reduction of resistivity of the Co samples. On the other hand, the graphitisation of carbon at temperatures higher than 200 °C is suggested as the main resistivity reduction mechanism in highly resistive deposits with low Cu and Au content.