Fig. 3.

Simulation of the von Mises stress distribution of the dendritic protrusions at different deposition heights. A vertical protrusion is grown from the lower deposition to the separator in all cases. This protrusion is located at the center of the XY plane. a Three-dimensional and cross-sectional view of the E-Cu@Li model. b Distribution of the protrusion stress in the control case with two-plate electrodes. c–e Distribution of the protrusion stress in the E-Cu-based case with the dendrite layer reaching c 95%, d 75% and e 50% of the height of the compartment. In the top right-hand corners of Fig. 3b–e, the relative area-average von Mises stress from the protrusion towards the separator is indicated