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. 2018 Feb 6;46(6):2956–2974. doi: 10.1093/nar/gky082

Figure 5.

Figure 5.

Kinetic scheme for the FEN1 reaction. FEN1 binds and bends a short DF substrate at diffusion-limited kinetics and commits to cleavage within the first encounter. After cleavage, the 5′ flap is released instantaneously while nicked product release occurs in two steps. FEN1 can rebind/rebend the nicked product at diffusion-limited kinetics, albeit with a lower on-rate than the substrate. With longer flaps, FEN1 can miss cleavage and dissociate from the bent substrate, requiring more than one attempt at cleavage. kbending-internal and product release rates are shown for non-EQ DF-6,1Internal at 40 mM KCl in presence of Mg2+. kSTO at 40 mM KCl is shown for EQ DF-6,1Flap in Supplementary Figure S2C; kSTO is independent of KCl concentration and it has been shown to be similar for both EQ DF-6,1Flap and non-EQ DF-6,1Flap (8). The substrate and product on/off rates are determined in presence of Ca2+; substrate EQ DF-6,1Internal at 100 mM KCl (Figure 2B) and product at 40 mM KCl (Supplementary Figure S2B). Based on data with the product (Supplementary Figure S2B), we do not anticipate a significant change in kon-bending of the substrate with lower KCl concentration.